sputtering

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sputtering

physics

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July 14, 2026

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Sputtering is a process where atoms, ions, or molecular species are ejected from the surface of a material due to ion-beam irradiation. This phenomenon is often achieved using noble gases like argon or neon to avoid unwanted chemical reactions with the target material.1

There are several mechanisms by which sputtering occurs:
* Rebound sputtering: An incident ion strikes a surface atom, causing it to recoil and collide with neighboring atoms, leading to ejection from the surface.1
* Recoil sputtering: A struck atom undergoes multiple elastic scatterings within the material, eventually migrating to and through the surface.1
* Prompt thermal sputtering: Energized atoms near the surface escape before annealing can occur.1
* Electronic sputtering: Energy from electronic excitations causes atomic recoil, ejecting ions from the surface.1

The number of atoms ejected per incident ion is known as the sputtering yield. Sputtering can alter surface characteristics, leading to structural, topographical, electronic, and compositional changes.1

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spectroscopy
Sputter atomization
…target in a process called sputtering. In the secondary ion mass spectrometry (SIMS) method, these secondary ions are used to gain information about the target material (see mass spectrometry: Secondary-ion emission). In contrast, the sputter-initiated RIS (SIRIS) method takes advantage of the much more numerous neutral atoms emitted in the…
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…target in a process called sputtering. In the secondary ion mass spectrometry (SIMS) method, these secondary ions are used to gain information about the target material (see mass spectrometry: Secondary-ion emission). In contrast, the sputter-initiated RIS (SIRIS) method takes advantage of the much more numerous neutral atoms emitted in the…
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advanced ceramics
Film deposition
Another PVD approach involves sputtering, in which energetic electrons bombard the surface of a target, removing material as a vapour that is deposited on an adjacent substrate. CVD involves passing a carrier gas over a volatile organometallic precursor; the gas and organometallic react, producing a ceramic compound that is…
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Another PVD approach involves sputtering, in which energetic electrons bombard the surface of a target, removing material as a vapour that is deposited on an adjacent substrate. CVD involves passing a carrier gas over a volatile organometallic precursor; the gas and organometallic react, producing a ceramic compound that is…
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integrated circuit
Physical methods
A common physical method is sputtering. In sputtering, a wafer and a metal source are placed in a vacuum chamber, and an inert gas such as argon is introduced at low pressure. The gas is then ionized by a radio-frequency power source, and the ions are accelerated by an electric…
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A common physical method is sputtering. In sputtering, a wafer and a metal source are placed in a vacuum chamber, and an inert gas such as argon is introduced at low pressure. The gas is then ionized by a radio-frequency power source, and the ions are accelerated by an electric…
Read More

mass spectrometry
Direct-current arc
…the ions, a process called sputtering. One disadvantage of this kind of ionization is the wide band of energies attained by the ions, ranging from the maximum electrode potential to almost zero. Such a distribution of energies was the cause of Thomson’s parabolas, but accurate work requires a narrow energy…
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…the ions, a process called sputtering. One disadvantage of this kind of ionization is the wide band of energies attained by the ions, ranging from the maximum electrode potential to almost zero. Such a distribution of energies was the cause of Thomson’s parabolas, but accurate work requires a narrow energy…
Read More

radiation
Surface effects
Sputtering is a process in which atoms, ions, and molecular species in the surface of a target material are ejected under the action of ion-beam irradiation. Energies typical of ion implantation are employed and, while any ion type may be used, noble (or rare) gases…
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Sputtering is a process in which atoms, ions, and molecular species in the surface of a target material are ejected under the action of ion-beam irradiation. Energies typical of ion implantation are employed and, while any ion type may be used, noble (or rare) gases…
Read More