recoil sputtering

Recoil sputtering is a process where atoms or ions are ejected from the surface of a material due to bombardment by energetic ions. This occurs when an incident ion strikes a surface atom, causing it to recoil and collide with other atoms. These collisions can lead to a cascade effect, ultimately ejecting surface material. The number of atoms ejected per incident ion is known as the sputtering yield.1

Sputtering can modify surfaces structurally, topographically, electronically, and compositionally. For instance, it can cause phase conversions, alter surface shapes, remove contaminants, and lead to preferential removal of certain atomic species from alloys. This process is utilized in various applications, including thin-film deposition and surface cleaning.1