package ceramics

Electronic substrate and package ceramics are advanced industrial materials crucial for producing electronic components. They function as insulating substrates, providing a base for microscopic electronic parts, and as protective packages that seal circuits from the environment.1

The primary material used is alumina (aluminum oxide, Al₂O₃), valued for its high resistivity, mechanical strength, and thermal stability. However, its relatively high dielectric constant and low thermal conductivity present challenges, leading to ongoing development of improved ceramic materials. These advanced ceramics, often referred to as technical or high-tech ceramics, are characterized by rigorously controlled composition and microstructure, enabling unique or superior functional attributes.123