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Why are ceramic electronic packages sealed in hydrogen or hydrogen-nitrogen atmospheres?

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Ceramic electronic packages are cofired in hydrogen or hydrogen-nitrogen atmospheres specifically to prevent the tungsten or molybdenum metallization lines from oxidizing during the high-temperature manufacturing process.1

When these advanced ceramics are processed at temperatures reaching 1,600° C (2,900° F), the protective gas environment ensures the integrity of the internal conductive pathways, allowing for the creation of a monolithic package that houses integrated circuits in a stable, hermetically sealed environment.1