How are silicon ingots turned into thin wafers?

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A periodic table element square for silicon shows atomic number 14, symbol Si, atomic weight range, electron configuration, and name. Icons indicate it is a solid nonmetal with diamond crystal structure and equal relative strength. Labels explain each property. — silicon Chemical properties of the element silicon.

To create thin wafers from a silicon ingot, the large, single-crystal ingot—produced via the Czochralski method—is sliced into thin sections, much like a loaf of bread.1

These resulting wafers serve as the substrate material for integrated circuits, providing the base upon which numerous circuits are fabricated simultaneously before being cut and separated.1